UltraFLEX
UltraFLEX
Test System Optimized for High-Performance Digital and SoC
Delivering superior economics and fast time to market with the industry’s highest rated software, the UltraFLEX test system has the power and precision you need for complex SoC devices. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.
Advantages
Superior Flexibility, Throughput & Scalability
The UltraFLEX scales from low pin count, analog-dominant devices to massive parallel test of high-end processors with superior parallel.
Maximum Test Quality and Yield
The UltraFLEX’s performance allows integrated circuit producers to meet the conflicting goals of “zero” defect rates and maximum device.
Faster Time to Production
Teradyne’s IG-XL software speeds time to market and reduces cost of test by transforming test program development.
Applications
- Mobile Application Processor
- Digital Baseband Processors
- High Data rate RF Transceivers
- RF Connectivity Devices
- mmWave
- 5G
- Mobile Power Management ICs (PMIC)
- MicroProcessors
- Network Processors
- High Speed SERDES (SERializer/DESerializer) and backplane transceivers
- Storage Controllers
- High End Microcontrollers
- Audio and Video Processors
Configurations
The three available UltraFLEX base systems allow customers to optimize capital cost, floor space and maximum resource count. All three versions will accept the same DIBs (Device Interface Boards) for application portability and use exactly the same instrument options for the most effective capital reuse and production flexibility. All heads feature a universal slot architecture, which allows any instrument to be installed in any slot.
The UltraFLEX test heads utilize SureMate® connections to the DIB which provides easy system reconfiguration and optimum instrument performance at the applications interface. Liquid cooling of high-density instrumentation also guarantees consistent hardware performance and increased reliability.
UltraFLEX-HD
12-slot system
UltraFLEX-SC
24-slot system
System Options
The UltraPin1600 high density, high speed digital provides 128 or 256 channels per instrument with test coverage up to 2.2Gbps. The UltraPin1600 implements Teradyne’s ground-breaking multicore, hardware-based Protocol Aware capability that allows individual pin groups to be saved to device data rate and timing and eliminates the need for digital patterns for programming standard data busses.
Proprietary hardware for same-cycle source synchronous capability and “walking strobe” timing measurements provides production test capability for high speed DDR and other critical applications when needed. The UltraPin1600 is also test program compatible with the earlier UltraPin800 and HSD1000 digital options.
The UltraWave12G/UltraWave24 high port count RF options provide up to 96 universal, vector RF ports with carrier frequencies and modulation bandwidths to cover the most advanced cellular and connectivity standards. The UltraWave options offer accuracy and phase noise performance equal to or better than the highest performance bench equipment available and integrate waveform sourcing and capturing onboard to eliminate the need for extra tester instruments. The UltraFLEX ESA software toolkit and UltraDSP1 option provide industry-standard modulation and demodulation tools running on up to 32 dedicated processing cores with automatic data download via a dedicated high speed data bus for simple correlation to industry standards and the highest possible throughput.
The UltraWaveMX44 and UltraWaveMX20 instruments enables faster time to market and higher product yields for semiconductor devices used in emerging mmWave applications. The MX44 and MX20 extend the UltraWave24 capability for full test coverage of IoT, WiFi, LTE, Ultra Wideband, and 5G standards while maintaining full DIB and docking compatibility.
The UltraPAC80 high density AC source and capture instrument offers up to 8 source and capture channels, each with dedicated audio and video analog paths. Teradyne’s proprietary sample clock architecture provides the user with complete sample frequency flexibility without performance compromise and guaranteed phase alignment to every other instrument on every run of the test program to eliminate the need for job-specific calibration to achieve the phase balance required for the highest performance RF transceivers.
The UltraVI80 high pin count, high accuracy voltage and current option provides 80 independent pins of “3-in-1” capability. Each UVI80 pin is a true voltage or current (VI) source and measure instrument complete with ultra high-accuracy differential voltmeters and time measurement units available to each pin for complete, massively paralleled testing of mobile power management devices. In addition, UVI80 channels can operate in a special, low-droop voltage source mode that offers unmatched power supply noise performance for sensitive analog and RF applications. Finally, each UVI80 channel has an embedded high performance AC waveform source and measure capability for highly paralleled test of D/A and A/D converters embedded in complex SOC or microcontroller devices.
The UltraVS256 high density Device Power Supply (DPS) provides 256 independent channels per instrument to provide the massively paralleled capability required by low power mobile communications devices. The UVS256 also offers a clamp-based current source capability for device parametric testing. The UVS256 provides test engineers with the capability of programmable output bandwidth and full pattern setup and measure control that results in reduced DIB complexity and faster test times.
The HEXVS and VSM Ultra High Accuracy and Stability Processor Core Supplies improve performance and yield of complex processors by offering unmatched voltage accuracy and stability under load. This allows devices to be configured for maximum performance at lower voltages, increasing the value and yield of devices tested on UltraFLEX.
The DC30 and DC75 voltage/current supplies extend DC capability to 30 volts and 75 volts to address high voltage test requirements of of mobile power management and other devices. Like the UltraVI80, both options contain a precision differential voltmeter and time measurement capability.
The UltraSerial60G is the first ATE solution for testing 60Gbps high-speed devices. Designed for device characterization and production test on UltraFLEX, the instrument has 32 TX and 32 RX differential ports, enabling the industry’s highest parallelism. UltraSerial60G also has 32 independent built-in digitizers that ensure bench-top test quality with no additional DIB circuitry.
The UltraPin4000 high speed, high precision digital option offers extremely high data rate capability with proprietary timing calibration options that allows unmatched timing accuracy to test the most challenging DDR interfaces on roadmap processors.
As the leading provider of complete Test Cell Solutions and services, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and the highest throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide standard and customized test cell products and services.